IRIS, the Wafer Metrology-Inspection system, is utilizing Nextin’s patent-awarded technology called Multiple Off-focus Image Process Technology to measure the vertical structures and find pattern defects during the HAR process steps in 3D semiconductor devices, as well as TSV processing in the Advanced 3D Packaging processes.

Applications

TSV Etch
3D NAND High-Aspect-Ratio Etch
Advanced 3D Package Etch