TWINS is an integration module to be installed onto the process equipment to measure the edge trimming processes and inspect its process defects.
During the current semiconductor production, after the Edge Trimming step, a separate stand-alone optical inspection system is required to inspect defects like cracks and chips. To prevent and solve the problems of manufacturing delay, cost increase, and random sampling test issue, TWINS is integrated onto the Edge Trimming process systems to monitor their edge trimming performance and detect the DOI’s (Defects of Interest) like cracks, and chips to continuously warrant the Edge Trimming process results real-time.
Real-time measurement of edge trimming amounts
Detection of crack and chips during the edge trimming process step
Wafer Edge inpsection